1、 Basic performance requirements for titanium target materials

① Purity is one of the main performance indicators of target materials, as the purity of the target material has a significant impact on the performance of the thin film. However, in practical applications, the purity requirements for the target material also vary. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has increased from 6 "and 8" to 12 ", while the wiring width has decreased from 0.5um to 0.25um, 0.18um, or 0.13um. Previously, 99.995% purity of the target material could meet the process requirements of 0.35um IC, while preparing 0.18um lines requires 99.999% or even 99.9999% purity of the target material.

② The impurities in the solid of the target material and the oxygen and water vapor in the pores are the main sources of pollution for depositing thin films. The requirements for different impurity contents of target materials for different purposes are also different. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.

③ In order to reduce the pores in the solid target material and improve the performance of sputtered films, it is usually required that the target material has a high density. The density of the target material not only affects the sputtering rate, but also affects the electrical and optical properties of the thin film. The higher the density of the target material, the better the performance of the film. In addition, increasing the density and strength of the target material enables it to better withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of target materials.

④ The grain size and grain size distribution of the target material are usually polycrystalline structures, with grain sizes ranging from micrometers to millimeters. For the same target material, the sputtering rate of targets with fine grains is faster than that of targets with coarse grains; The thickness distribution of thin films deposited by target sputtering with small differences in grain size (uniform distribution) is more uniform.

2、 Purity requirements for titanium target materials in different industries

① Titanium target materials used in integrated circuits

The purity requirement for integrated circuit titanium targets is mainly greater than 99.995%, which is higher than the purity used in non integrated circuits.  

② Titanium target materials used in flat panel displays

Flat panel displays include liquid crystal displays, plasma displays, electroluminescent displays, and field emission displays. Sputtering coating technology is commonly used to deposit thin films for flat panel displays. Al, Cu, Ti, and Mo are the main metal sputtering targets for flat panel displays. The purity of titanium targets used for flat panel displays typically needs to be greater than 99.9%.

Titanium can be used as a raw material to produce titanium sputtering targets through several methods, which can be widely applied in high-tech fields such as electronics, information industry, home decoration, and automotive glass manufacturing. In these industries, titanium target materials are mainly used for coating surface panel displays of integrated circuits, flat panels, and other components, or as decorations and glass coatings.